VeriSilicon provides full-process silicon design service from chip definition to tape-out, and silicon-proven, platform-based solutions for shortening design cycles. In addition, VeriSilicon helps customers to outsource wafer fabrication, chip packaging and testing, while providing high-quality production management services.

芯原的一站式芯片定制服务能够在短时间内打造出从定义到测试封装完成的半导体产品，并提供相应的软件设计服务，为芯片设计公司和IDM、系统厂商、大型互联网公司、云服务提供商在内的各种客户提供高效经济的半导体产品替代解决方案，其终端应用可覆盖消费电子、汽车电子、计算机及周边、工业、数据处理和物联网等广泛的行业应用市场。

在SiPaaS模式下，芯原以自主拥有的IP为核心，基于公司先进的芯片设计能力和量产服务经验，打造了多种经过硅验证的芯片设计平台，可大幅降低客户的芯片设计周期和设计风险，并为芯原的服务质量和效率提供了保证。

VeriSilicon can create silicon products from definition to test and package in a short time based on its one-stop custom silicon service, and provides high performance and cost-efficient semiconductor alternative products for IDM, Fabless, system vendors (OEM/ODM) and large Internet companies, etc. Our services cover various application fields including consumer electronics, automotive electronics, computer and peripheral, industry, data processing and IoT sectors.

Under the SiPaaS business mode, by leveraging the Company's semiconductor IP resources and advanced R&D capabilities, VeriSilicon has accumulates a variety of silicon-proven design platforms that can significantly reduce the silicon design cycles and design risks with guaranteed quality and efficiency of our service.

芯原根据自身技术优势、设计经验、目标客户群体需求及对行业的理解，打造了一系列经过验证的、系统性的一站式芯片定制解决方案，具体包括高清视频、高清音频及语音、车载娱乐系统处理器、视频监控、物联网连接、智慧可穿戴、高端应用处理器、视频转码加速和智能像素处理等解决方案。

请将您的芯片设计需求提交给芯原，我们将与您通力合作，共同打造优秀的半导体产品。

Based on our technical advantages, design experience, customer needs and our understanding of the industry, VeriSilicon has accumulated many silicon-proven and systematic solutions for customers, including HD video solutions, HD audio and voice solutions, In-Vehicle Infotainment processer solutions, video surveillance solutions, IoT connectivity solutions, data center solutions, etc.

Please submit your design requirements to us. Let’s create excellent semiconductor products together.