VeriSilicon offers turnkey services such as outsourcing wafer fabrication, packaging, testing, product certification, and failure analysis services, according to customized demands, and provides production management services in the above processes. VeriSilicon's chip production services aim to support the manufacture of customers' products with high quality and fast response.
Based on the unique demands of each customer, VeriSilicon identifies and selects the most suitable foundry and process technology to deliver a well-balanced solution with high performance, cost-effective and quality, providing customers with the competitive chip products.
VeriSilicon's packaging solutions allow real-time design fine-tuning of chip package substrate and rapid problem solving. Our expertise in design, simulation, and engineering ensures efficient package development and production management.
VeriSilicon's test development services aim to eliminate the imbalance between design and testing. It provides early turnarounds and ensure test quality by commencing testing ASAP in the project design phase.
Quality and Reliability
With many years of experience in working with leading manufacturers at home and abroad, VeriSilicon is capable to help customers build a comprehensive, efficient and reliable chip production management system, thus to enhance the quality competitiveness of their products.