Packaging Service

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VeriSilicon's packaging solutions allow real-time design fine-tuning of chip package substrate and rapid problem solving. Our expertise in design, simulation, and engineering ensures efficient package development and production management. Our main services include:

Package design service

Package evaluation

Package design and modeling

Chip package substrate collaborative design and co-simulation

Package manufacturing service

Prototype delivery

BOM and process development

Package qualification inspection

Package yield monitoring and subcontractor management

VeriSilicon has gained advanced system-in-package (SiP) assembly technology and test methods, and has established a mature SiP ecosystem. By using VeriSilicon's one-stop SiP service, our customers benefit from differentiated products with smaller size, better electrical performance, lower power consumption, faster time to market and better cost-competitiveness.

SiP technical advice and cost estimates
Passive components purchase and management
Test design, test plan and test program development
Reliability certification service
Domestic/overseas logistics
Continuously cost-reducing solutions

Purchase and management of third-party qualified bare chips (KGD)
Package design, chip-package-PCB substrate collaborative design/co-simulation
SLT (System Level Test)
Commissioning/fault analysis
Product quick release
Flexible business cooperation

Packaging Service

Example of VeriSilicon Package Service

SiP Design Flow

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