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Die-to-Die (D2D) Interface for Chiplet Application

The UCIe PHY IP is a market-leading, ultra low-power, and low-latency interface IP for high-bandwidth connections between two dies that are on the same substrate. The PHY IP implements a wide-parallel and forwarded-clock PHY interface for multi-channel interconnections at data rate up to 24 Gbps per pin.

The PHY IP is configurable to support the leading standards in the industry Universal Chiplet Interconnect Express (UCIe)--providing customers a Die-to-Die (D2D) solution that is compliant with industry standards.

UCIe-SP.png


Features

  • Compliant with the UCIe Specification Revision 1.1

  • Supports 4, 8, 12, 16, and 24 GT/s data rates

  • Self-calibrating and training

  • Supports muti-module (1, 2, or 4) design

  • Sideband channel for initialization and parameter exchange

  • Built-in self-test (BIST), internal loopback, and external PHY-to-PHY link test

  • On-chip calibration for termination impedance

  • Flexible configuration: 16 RX and TX pins per module (standard package)

  • Supports a minimum output driver voltage of 0.5 V

  • Junction temperature range: -40°C to 125°C

  • Package type: standard package

  • Power consumption: < 1.2 pJ/bit @ 16 Gbps (standard package)

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