公司

关于芯原
管理团队
新闻发布
公司动态
市场活动
合作伙伴
加入我们
商标
联系我们

投资者关系

董事成员
主要投资者
股票信息
投资者联系
可持续发展报告
Die-to-Die (D2D) Interface for Chiplet Application

The UCIe PHY IP is a market-leading, ultra low-power, and low-latency interface IP for high-bandwidth connections between two dies that are on the same substrate. The PHY IP implements a wide-parallel and forwarded-clock PHY interface for multi-channel interconnections at data rate up to 24 Gbps per pin.

The PHY IP is configurable to support the leading standards in the industry Universal Chiplet Interconnect Express (UCIe)--providing customers a Die-to-Die (D2D) solution that is compliant with industry standards.

UCIe-SP.png

Features

  • Compliant with the UCIe Specification Revision 1.1

  • Supports 4, 8, 12, 16, and 24 GT/s data rates

  • Self-calibrating and training

  • Supports muti-module (1, 2, or 4) design

  • Sideband channel for initialization and parameter exchange

  • Built-in self-test (BIST), internal loopback, and external PHY-to-PHY link test

  • On-chip calibration for termination impedance

  • Flexible configuration: 16 RX and TX pins per module (standard package)

  • Supports a minimum output driver voltage of 0.5 V

  • Junction temperature range: -40°C to 125°C

  • Package type: standard package

  • Power consumption: < 1.2 pJ/bit @ 16 Gbps (standard package)

搜索

联系

语言

简体中文

English

日本語

芯原股份 (688521.SH)
感谢您的订阅
感谢您通过邮件.订阅芯原的最新消息。在您等待我们网站的下次更新时,我们邀请您通过以下资源来了解芯原的更多信息。
芯片定制解决方案
Vivante图形处理器IP
Vivante神经网络处理器IP
ZSP数字信号处理器IP
Hantro视频处理器IP
关于芯原
关闭