VeriSilicon exhibited at Embedded World 2023

Embedded World 2023 was held at the Nuremberg Exhibition Center in Germany from Mar. 14 to Mar. 16. As a leading provider of custom silicon services and semiconductor IP licensing services, VeriSilicon showcased  its comprehensive solutions of  custom silicon, software and IP at this exhibition.  

VeriSilicon also hosted a Chiplet Forum, where Dr. Wayne Dai, Chairman, President and CEO of VeriSilicon, delivered a speech entitled “How to Make Chiplet Real”, elaborating on the current status, challenges, and opportunities of chiplet technology.  

Launched in 2003, Embedded World is one of the most important annual events for the international embedded community. This year, the exhibition attracted companies from all over the world with over 950 exhibitors participated.