eriSilicon's Design Services draws on the skills of over 150 highly experienced silicon designers with significant expertise in solving the most challenging SoC design problems. Some examples include designing multiprocessor ASICs, implementing multi-million gate System-on-a-Chip (SoC), handling sub-micron and mixed signal design and end-to-end system solutions to match the complexity and keeping up with the design problems of shrinking geometry and power. Our design engineers are also skilled in the latest EDA technology and experienced in the latest process technologies and design practices, and bring that knowledge and expertise to each and every customer engagement. |
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Over the past four years, VeriSilicon has designed many complex, multi-million gate SoC's with "first silicon success" for customers with some highlights being: |
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VoIP over WiFi chip targeting dual-mode cellular phones (system specification to packaged silicon)
3G TD-SCDMA base-band chip
A chip for fingerprint processing with embedded DSP core
An audio ring-tone chip
An ARM core based chip targeting portable media player applications
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VeriSilicon's global design teams have the capacity to handle multiple silicon projects throughout our global R&D centers, and tape out on average one chip per week. Most of the designs are targeted at state-of-the art deep submicron process technologies. |
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Whether you want to complement your design team's competencies with VeriSilicon's experienced design engineers as an extension to your development team or outsource the entire design to VeriSilicon or any combination in between, VeriSilicon's flexible engagement model can best address your resource needs and meet your design goals. |