平台化芯片设计服务
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产品工程服务
 

The service is offered to take products from prototyping to mass production in a timely manner. It includes Wafer fabrication, Wafer probe test, assembly and packaged chip test. Product engineering team coordinates different parts of the manufacturing services by using sophisticated engineering data analysis tools, the Tango system and advanced failure analysis (FA) methodology, as well as Design-For-Production (DFP) Technology, so as to accelerate product time-to-market and time-to-volume.

  • PRODUCT ENGINEERING
  • Early involvement at design stage for DFM
  • Bench test and device characterization
  • Device qualification
  • Yield continuously improvement
  • Low yield trouble shooting
  • RMA engineering analysis
  • PROJECT MANAGEMENT
  • New product introduction Turnkey project coordination and management
  • Schedule control for wafer, package and testing
  • Production release control
  • Production maintain
 

Tango system is a Data Management System which is used for WAT (Wafer Accept Test) + CP (Chip Probing) + FT (Final Test) + STDF data maintain and analysis.

In-house Tool Diagram

 

DFP (Design / Diagnose-For-Production) is a dynamic FA solution.

DFP can combine various silicon knowledge bases with production requirements in different verification phases to shorten the time-to-market and enable very high hit rates for timing-related issues.

Advanced FA Methodology - DFP Solution 

 

Failure Analysis Capability